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OPTIC 3D Podcasts
As a semiconductor industry community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.The 3D InCites Podcast provides a forum for our community members to discuss all kinds of topics that are important to running a business in the semiconductor ind ...
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Transformational Pediatrics features interviews with physicians and researchers at Children’s Mercy Kansas City who are transforming pediatric care through genomic medicine, personalized therapeutics, health services and outcomes research, and innovations in health care delivery.
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What Happens When Support, Grit, And Communication Shape Women’s STEM Journeys
47:15
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47:15Want a candid look at how women build durable careers in one of the world’s toughest industries? We sit down with three semiconductor leaders - Nitza Basoco, Anne Meixner and Julia Freer - who share how early encouragement, gritty problem solving, and clear communication turned curiosity into impact. From summer jobs at national labs and early days…
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How Wide Bandgap Materials Are Rewiring Energy Efficiency
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32:46Power electronics are quietly rewriting the rules of energy use—from the range of your EV to the efficiency of a hyperscale data center. Françoise sits down with Henkel’s Ram Trichur to unpack what’s driving the $67.5B surge in power semiconductors and why the move to wide bandgap materials like silicon carbide and gallium nitride is such a big dea…
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From Hybrid Bonding To AI Power: Live At SEMICON West
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1:33:06
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1:33:06The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-…
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Children’s Mercy is transforming pediatric genetic diagnosis with a single, advanced sequencing test. Learn how this breakthrough is delivering faster answers, fewer tests, and new hope for families facing rare diseases.By Children’s Mercy Kansas City
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Building The U.S. Microelectronics Workforce; A Collective Plan for Sustainable Semiconductors
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31:24
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31:24A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act funding through the Nati…
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3D InCites Member Spotlight: Why the Front End Needs the Back End To Win in AI
1:05:55
1:05:55
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1:05:55We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, thermal and test roadblocks, green chemistries, metrology at scale, and why the back end now leads innovatio…
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First Impressions, Lasting Paths at IMAPS Symposium 2025
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20:23
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20:23We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter. • why a self-funded first conference can reset a caree…
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IMAPS Symposium 2025: Chiplets vs. Dielets and the Truth about Co-Packaged Optics
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45:56We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly, Amkor; and Tolga Tekin, Fraunhofer IZM on co‑packaged optics, bandwidth, and power for AI data centers. • chiplet …
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The Unseen Force Behind Semiconductor Device Reliability
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43:28A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider. Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring…
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Join Dr. Anmol Goyal as he explains the educational power of 3D modeling in explaining complex heart conditions. This episode highlights how visual tools help families understand diagnoses and surgical procedures, making complex medical terms accessible to everyone. Learn more about Anmol Goyal, MD, MBBS…
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Relocating SEMICON West: Phoenix's Rise in the Semiconductor Industry
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25:51SEMI's flagship event, SEMICON West, is moving to Phoenix, Arizona this October 7-9, 2025, after 35 years in San Francisco, coinciding with the region's semiconductor manufacturing boom and $200 billion in announced investments. In this episode, Françoise speaks with SEMI Americas president, Joe Stockunas, who shares reasons for the move and what a…
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San Diego Calling: Your Complete Guide to the IMAPS Symposium
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29:12The IMAPS International Symposium returns to the Town & Country Resort in San Diego from September 29-October 2, 2024, featuring restructured technical tracks, new Monday panel discussions, and exciting networking events including a special reception aboard the USS Midway aircraft carrier. General Chair Benson Chan and outgoing IMAPS President Eric…
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J. Allyson Hays, MD, discusses the rare disease histiocytosis, how it presents in pediatric cases, how Children's Mercy treats it and more. Learn more about Allyson Hays, MDBy Children’s Mercy Kansas City
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Beyond Silicon: The Power of X-Ray Metrology in Advanced Packaging
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32:34X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manuf…
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Can Thailand Compete in the Global Chip Race?
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18:27
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18:27Thailand is positioning itself as a new hotspot for semiconductor and microelectronics manufacturing, building on existing infrastructure and establishing key partnerships throughout the region. Managing editor Jillian McNichol shares insights from her recent trip to Thailand where she toured facilities and interviewed industry leaders about the co…
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From Electrons to Photons: ASE's Vision for Sustainable AI
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24:10
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24:10The race toward more powerful AI carries a hidden cost that's becoming impossible to ignore: skyrocketing energy consumption. Did you know AI is projected to devour 10% of global electricity by 2030? This staggering figure has even forced tech giants to delay their sustainability goals. Enter ASE's Executive Vice President Yin Chang, who reveals ho…
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Mark Ryan, MD, MSPH, FACS, discusses the use of virtual reality and 3D imaging in pediatric surgery, and the impact it has on planning, outcomes and the future of pediatric procedures.By Children’s Mercy Kansas City
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Discover the unique challenges faced by adolescent kidney transplant recipients and their families in this deep dive into patient-centered assessments. Host Dr. Mike and pediatric nephrologist Dr. Judith Van Sickle discuss barriers to medical adherence and the importance of a supportive network in optimizing health outcomes for young patients.…
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3D InCites Members Reveal Breakthrough Technologies at ECTC 2025
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1:15:07The 75th anniversary celebration of ECTC in Dallas showcases a remarkable evolution in advanced packaging technologies, revealing how semiconductor priorities have dramatically shifted. Rather than the relentless miniaturization of the smartphone era, today's AI-driven applications demand larger packages with more functionality and sophisticated th…
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The AI Revolution: Energy, Ethics, and Advanced Packaging
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14:59What happens when the world's thirst for artificial intelligence collides with physical limitations? The answer lies at the intersection of silicon innovation and packaging technology. From the conference hall of ECTC 2025 in Dallas, we're joined by Sam Naffziger of AMD who reveals how AI has transformed from a peripheral topic to the dominant forc…
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ECTC at 75: Pioneers Reflect on Packaging's Past and Future
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26:50What happens when you gather 75 years of packaging innovation under one roof? The Electronic Component Technology Conference (ECTC) has transformed from a modest gathering of 300 electronics professionals to a powerhouse event attracting over 2,500 industry leaders, researchers, and visionaries. This remarkable journey reflects how advanced packagi…
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From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
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36:37Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall" • Economic realities of advanced nodes mean com…
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Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage
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20:06Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality. • X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality • Traditional 2D radiograp…
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The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025
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31:45The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-20, has become i…
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Acoustic Inspection: The Key to Semiconductor Reliability
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31:11Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials. …
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Tomoo Iwakuma, MD, PhD, discusses recent research findings around his studies of the p53 gene.By Children’s Mercy Kansas City
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Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
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1:00:02The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across squa…
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Why Supply Chain Resilience Matters and How to Get It
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37:32Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment. The semiconductor industry operates at extraordinary …
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3D InCites Member Spotlight: How Advanced Packaging is Transforming the Semiconductor Landscape
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41:45The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as…
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From IMAPS DPC 2025: How Arizona's Universities and Schools Are Revolutionizing Semiconductor Education
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42:59Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the nation's first hi…
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From IMAPS DPC 2025: How Artificial Intelligence is Transforming Industries and Society
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23:51What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert panel featuring …
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What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
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26:43Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor oppo…
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SEMI ISS 2025 Recap and Semiconductor Market Update
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37:32The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI's Market Intelligenc…
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The Role of Material Modeling in Semiconductor Packaging Innovation
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32:56
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32:56Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving demands of AI, mach…
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Koh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor Manufacturing
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18:55
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18:55This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains why non-destruc…
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SEMICON Europa 3D InCites Member Spotlight: 20 Under 30 Recipients and More
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46:10This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectronics industry.…
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SEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty?
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44:45In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semiconductor industry…
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SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth?
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42:30This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going…
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It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress. First up is D…
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Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging
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1:04:58On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP technologies fo…
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Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway
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53:29For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing dies and chiplet…
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LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024
1:24:06
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1:24:06Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates for advanced pac…
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Children’s Mercy Kansas City is the first pediatric hospital in the U.S. to clinically launch Optical Genome Mapping (OGM), an advanced digitized technology that enhances the detection of genetic abnormalities. Dr. John Herriges discusses what this means for pediatric care and what's to come.By Children’s Mercy Kansas City
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IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers
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20:30At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise sits down with…
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Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging
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47:46This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act's funding distribution and its impact on the semicond…
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Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI
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39:11In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HBM uses advanced…
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Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips
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20:52In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI technologies themsel…
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So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX
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34:43In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging. McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and FreePower; and h…
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Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging
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29:58In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s on…
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Tarak Railkar and Benson Chan Preview IMAPS Symposium 2024
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23:40In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical pro…
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