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Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage

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Manage episode 484175232 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

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Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. Nordson Test and Inspection Sponsorship (00:00:00)

2. Introduction to X-Ray Inspection (00:00:58)

3. Challenges of Planar CT Imaging (00:02:48)

4. Dynamic Planar CT Technology (00:07:40)

5. Applications in Volume Manufacturing (00:12:44)

6. Nordson's AXI Solutions Overview (00:16:53)

7. Key Takeaways and Conclusion (00:19:46)

166 episodes

Artwork
iconShare
 
Manage episode 484175232 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Send us a text

Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality.
• X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality
• Traditional 2D radiographic imaging is being replaced by 3D imaging for more stringent manufacturing requirements
• Planar CT imaging suffers from artifacts when inspecting flat electronic components like circuit boards and wafers
• Dynamic Planar CT takes more images from different angles with a wider field of view, reducing artifacts
• New technology operates twice as fast as traditional methods while reducing x-ray dose to sensitive components
• Automated inspection systems integrate directly into manufacturing lines with no human interaction required
• Common applications include detecting voids in ball grid arrays and micro bumps in flip chip devices
• The technology supports Quality 4.0 initiatives by providing feedback to improve manufacturing processes
• Nordson's systems are in use worldwide with an install base exceeding 2000 automated x-ray inspection systems
Learn more about Dynamic Planar CT and Nordson's x-ray inspection solutions at nordson.com or on their YouTube channel.
Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. Nordson Test and Inspection Sponsorship (00:00:00)

2. Introduction to X-Ray Inspection (00:00:58)

3. Challenges of Planar CT Imaging (00:02:48)

4. Dynamic Planar CT Technology (00:07:40)

5. Applications in Volume Manufacturing (00:12:44)

6. Nordson's AXI Solutions Overview (00:16:53)

7. Key Takeaways and Conclusion (00:19:46)

166 episodes

All episodes

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