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What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman
Manage episode 466459367 series 2935206
Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.
Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Chapters
1. IMAPS DPC Conference Preview (00:00:00)
2. AI Infrastructure Challenges Panel Discussion (00:11:11)
3. Networking and Community Building Activities (00:21:29)
181 episodes
Manage episode 466459367 series 2935206
Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and exhibitor opportunities reflecting the rising interest in this field. Get ready to embrace the future of packaging with insights that redefine its significance in the semiconductor industry.
Uncover the critical challenges facing AI infrastructure in a thought-provoking panel discussion with experts from IBM Research, Intel, and leading OSATs. We'll tackle whether today's infrastructure can keep pace with AI's explosive growth, especially concerning energy-efficient chip designs and packaging solutions. Learn about groundbreaking advancements and the potential to alleviate data center power consumption concerns through innovative packaging techniques. Beyond the tech talk, we'll highlight the vibrant networking scene at the conference, featuring events like the Backyard Olympics and a charity golf tournament, ensuring a perfect blend of professional growth and community building. Join us for a chance to network, learn, and potentially reshape the future of microelectronics packaging.
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Chapters
1. IMAPS DPC Conference Preview (00:00:00)
2. AI Infrastructure Challenges Panel Discussion (00:11:11)
3. Networking and Community Building Activities (00:21:29)
181 episodes
All episodes
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