From Hybrid Bonding To AI Power: Live At SEMICON West 3D InCites podcast

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From Hybrid Bonding To AI Power: Live At SEMICON West

1d ago 1:33:07

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The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips.
EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so every die and corner is verified. They also unveiled LithoScale XT, a fully digital, maskless lithography system printing 300 mm at 60 wph—perfect for massive AI dies and fast design turns.

Lab14 widened the frame with a portfolio approach: direct-write lithography, single-wafer processing, data prep, and analysis tools working as a coordinated line, with data sharing and AI feedback baked in.
Resilience and regionalization came to life through Kuehne+Nagel’s on-the-ground view: supplier clustering near fabs, cross-border trucking, time-critical services, and 4PL integration that gives real-time visibility and smarter capacity planning.

ERS showed where throughput meets cost: photothermal debonding with lower stress and reusable glass carriers, demo centers in Taiwan (and planned in North America), plus surge demand for warpage repair as volumes rise.
Process control is moving into packaging with front-end rigor. Nova detailed metrology for hybrid bonding, chemistry monitoring of plating baths, X-ray and XPS/SIMS material insights, and the handling know-how to measure framed wafers and panels reliably.

Nordson Test & Inspection highlighted AI-driven inspection, ultra-fast acoustic scanning, automated X-ray metrology, and sensor wafers that cut tool downtime and sharpen process windows. Comet showcased its CT and CA20 upgrades for 3D IC and TSV analysis.
Power dominated the later conversations. Siemens argued we need to design for energy from the chip through the blade, rack, and data center, simulating real workloads and cooling to slash gigawatts—then extend that thinking into the fab, where optimizing chillers and facilities already saves serious money.

Onto Innovation brought it home with execution: the PACE Center now hosts partners’ tools, accelerating experiments for glass, TGV, and panel processes without waiting on public funds.
If you care about hybrid bonding, maskless lithography, CT for 3D ICs, panel-scale packaging, or cutting AI’s energy bill, this one is dense with takeaways and hard truths. Subscribe, share with a colleague who lives in the fab or data center, and leave a review telling us which insight you’ll act on first.
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Chapters

1. Opening And Semicon West In Phoenix (00:00:00)

2. EV Group: Arizona Milestone And New Tools (00:01:04)

3. Die‑To‑Wafer Metrology And Maskless Lithography (00:06:29)

4. Lab14’s Origin And Portfolio Strategy (00:08:53)

5. Advanced Packaging Use Cases And Data Synergy (00:13:44)

6. Kuehne+Nagel On Regionalization And 4PL (00:17:03)

7. U.S. Packaging Onshoring And Automation Outlook (00:22:31)

8. ERS: Demo Centers And Photothermal Debonding (00:26:52)

9. Warpage Repair And Panel/Wafer Flexibility (00:32:52)

10. Nova: Process Control For Advanced Packaging (00:36:32)

11. Chemistry Monitoring And Handling Complexities (00:42:47)

12. Nordson T&I: Growth, AI Inspection, And Sensors (00:47:15)

13. Comet: U.S. Footprint, Talent, And CT Launches (00:53:44)

14. Siemens: Cutting Compute Power From Chip To Data Center (01:00:12)

15. Foundry Efficiency And Fab Optimization (01:07:12)

16. Onto Innovation: PACE Center And Packaging Reality (01:12:16)

17. Tariffs, Supply Chains, And What’s Next (01:20:15)

18. Season Preview And Closing (01:24:40)

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