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Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging

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Manage episode 439531293 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

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In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.

You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:

  • Hybrid bonding
  • 3D stacking with micro bumps
  • RDL applications for interposers
  • TSV applications

The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.

Contact Our Guests on LinkedIn

· Monita Pau

· Jiangtao Hu

Onto Innovation
Your partner for innovative solutions that improve time to market, yield, and product reliability.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

176 episodes

Artwork
iconShare
 
Manage episode 439531293 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Send us a text

In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them?
In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine features. It’s only recently become important to back-end advanced packaging processes – especially for heterogeneous integration. As chips are designed with smaller features, advanced packaging processes are becoming more front-end like.

You’ll learn about how metrology designed for front-end manufacturing is being reimagined for wafer-level and assembly applications such as:

  • Hybrid bonding
  • 3D stacking with micro bumps
  • RDL applications for interposers
  • TSV applications

The speakers discuss the challenges, gaps, and solutions for each. You’ll also learn what makes Onto Innovation uniquely qualified to support this.

Contact Our Guests on LinkedIn

· Monita Pau

· Jiangtao Hu

Onto Innovation
Your partner for innovative solutions that improve time to market, yield, and product reliability.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

176 episodes

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