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Beyond Silicon: The Power of X-Ray Metrology in Advanced Packaging

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Manage episode 502942571 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

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X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manufacturing on track.
With nearly three decades of experience in the industry, Peecock guides us through the evolution of semiconductor inspection technologies. While silicon itself remains transparent to x-rays, the metal interconnects between components provide the perfect canvas for quality assessment. As advanced packaging pushes toward smaller, more complex structures with 3D stacking and chiplet architectures, the need for sophisticated inspection has never been greater.
We explore how inspection (focused on imagery) and metrology (centered on precise measurements) serve complementary roles across the semiconductor manufacturing ecosystem. From R&D laboratories perfecting new processes to high-volume production lines seeking zero defects, these technologies help manufacturers identify issues before they become costly failures. The conversation ventures into the distinctions between 2D inspection (optimized for speed) and 3D analysis (delivering comprehensive structural information) and when each approach proves most valuable.
Particularly fascinating is Nordson's approach to vertical integration, developing their own specialized x-ray sources and detectors optimized specifically for semiconductor applications. This expertise extends to their innovative work integrating artificial intelligence to accelerate inspections while maintaining accuracy. Their thoughtful approach to data security gives customers options to protect proprietary information while still benefiting from AI's capabilities.
Discover how these technologies are already supporting emerging trends like panel-level packaging and learn about Nordson's unique radiation management solutions that protect sensitive components during inspection. Whether you're a semiconductor professional seeking quality control insights or simply curious about the technologies that ensure your electronic devices function reliably, this episode offers a fascinating glimpse into an invisible world of quality assurance.

Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. Podcast Introduction and Sponsorship (00:00:00)

2. Meeting Ben Peacock from Nordson (00:01:30)

3. X-Ray Inspection vs. Metrology Explained (00:05:23)

4. Advanced Packaging Trends and Needs (00:09:28)

5. 2D vs. 3D X-Ray Technologies (00:14:26)

6. Nordson's X-Ray Solutions Portfolio (00:19:00)

7. AI Integration and Data Security (00:25:07)

8. Radiation Management and Closing Thoughts (00:30:00)

176 episodes

Artwork
iconShare
 
Manage episode 502942571 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Send us a text

X-ray technology reveals what the naked eye cannot see - the intricate world of semiconductor interconnects that power our digital lives. In this deep dive with Ben Peecock, Senior Director of Business Development at Nordson Test and Inspection, we uncover the critical differences between x-ray inspection and metrology that keep semiconductor manufacturing on track.
With nearly three decades of experience in the industry, Peecock guides us through the evolution of semiconductor inspection technologies. While silicon itself remains transparent to x-rays, the metal interconnects between components provide the perfect canvas for quality assessment. As advanced packaging pushes toward smaller, more complex structures with 3D stacking and chiplet architectures, the need for sophisticated inspection has never been greater.
We explore how inspection (focused on imagery) and metrology (centered on precise measurements) serve complementary roles across the semiconductor manufacturing ecosystem. From R&D laboratories perfecting new processes to high-volume production lines seeking zero defects, these technologies help manufacturers identify issues before they become costly failures. The conversation ventures into the distinctions between 2D inspection (optimized for speed) and 3D analysis (delivering comprehensive structural information) and when each approach proves most valuable.
Particularly fascinating is Nordson's approach to vertical integration, developing their own specialized x-ray sources and detectors optimized specifically for semiconductor applications. This expertise extends to their innovative work integrating artificial intelligence to accelerate inspections while maintaining accuracy. Their thoughtful approach to data security gives customers options to protect proprietary information while still benefiting from AI's capabilities.
Discover how these technologies are already supporting emerging trends like panel-level packaging and learn about Nordson's unique radiation management solutions that protect sensitive components during inspection. Whether you're a semiconductor professional seeking quality control insights or simply curious about the technologies that ensure your electronic devices function reliably, this episode offers a fascinating glimpse into an invisible world of quality assurance.

Nordson Test and Inspection
Delivering best-in-class test, inspection, and metrology solutions for semiconductor applications.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. Podcast Introduction and Sponsorship (00:00:00)

2. Meeting Ben Peacock from Nordson (00:01:30)

3. X-Ray Inspection vs. Metrology Explained (00:05:23)

4. Advanced Packaging Trends and Needs (00:09:28)

5. 2D vs. 3D X-Ray Technologies (00:14:26)

6. Nordson's X-Ray Solutions Portfolio (00:19:00)

7. AI Integration and Data Security (00:25:07)

8. Radiation Management and Closing Thoughts (00:30:00)

176 episodes

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