Best Francoise von Trapp Podcasts (2025)

1
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies 36:37

1h ago36:37

36:37

Send us a text Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall" • Economic realities of advanced…

1
Revolutionizing Semiconductor Quality: The Dynamic Planar CT Advantage 20:06

7d ago20:06

20:06

Send us a text Andrew Mathers, Principal Product Line Manager at Nordson Test and Inspection, discusses the revolutionary advancements in 3D x-ray inspection technology and how they're improving semiconductor manufacturing quality. • X-ray inspection requires high resolution, speed, and cost-effectiveness to drive better product quality • Tradition…

1
The Wireless Golden Gateway: Why Advanced Packaging Professionals Should Attend IMS 2025 31:45

14d ago31:45

31:45

Send us a text The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco's Moscone Center from June 15-2…

1
Acoustic Inspection: The Key to Semiconductor Reliability 31:11

1M ago31:11

31:11

Send us a text Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-li…

1
Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration 1:01:29

2M ago1:01:29

1:01:29

Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniform…

1
Why Supply Chain Resilience Matters and How to Get It 37:32

2M ago37:32

37:32

Send us a text Navigating today's complex manufacturing landscape demands unprecedented supply chain resilience. This eye-opening conversation with Barry O'Dowd (Kuehne+Nagel) and Kamal Ahluwalia (Resilinc) reveals why robust supply chains matter more than ever—particularly for semiconductor capital equipment. The semiconductor industry operates at…

1
3D InCites Member Spotlight: How Advanced Packaging is Transforming the Semiconductor Landscape 43:13

2M ago43:13

43:13

Send us a text The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, estab…

1
From IMAPS DPC 2025: How Arizona's Universities and Schools Are Revolutionizing Semiconductor Education 44:27

2M ago44:27

44:27

Send us a text Arizona is transforming into the "Silicon Oasis" of America through an unprecedented collaboration that's reshaping semiconductor education from high school through graduate studies. At the heart of this revolution is a groundbreaking partnership between the University of Arizona and Chandler Unified School District, launching the na…

1
From IMAPS DPC 2025: How Artificial Intelligence is Transforming Industries and Society 24:39

3M ago24:39

24:39

Send us a text What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona. Join our expert p…

1
What's In Store for IMAPS DPC 2025: Featuring Amy Lujan, Tim Olson, and Jan Vardaman 27:31

4M ago27:31

27:31

Send us a text Explore the transformative world of microelectronics packaging with industry visionaries Amy Lujan, Tim Olson, and Jan Vardaman as they share their journey at the IMAPS Annual Device Packaging Conference (DPC). With the conference relocating to the vast Wild Horse Pass, expect an enriched experience with expanded technical tracks and…

1
SEMI ISS 2025 Recap and Semiconductor Market Update 39:00

4M ago39:00

39:00

Send us a text The episode explores the key insights from the recent SEMI ISS event, focusing on the semiconductor industry's journey toward a trillion-dollar market by 2030. It discusses the significant themes of uncertainty and the transformative impact of AI, while also addressing industry challenges and emerging trends. Additionally, SEMI's Mar…

1
The Role of Material Modeling in Semiconductor Packaging Innovation 32:56

5M ago32:56

32:56

Send us a text Unlock the secrets of semiconductor packaging materials with insights from industry experts Dariush Tari and Rose Guino of Henkel's Semiconductor Packaging Materials Division. This episode promises a deep dive into the processes behind developing materials that are both reliable and high-performing, crucial for the ever-evolving dema…

1
Koh Young's Michael Zahn Talks About Putting 3D Measurement Technology to Work for Semiconductor Manufacturing 18:55

6M ago18:55

18:55

Send us a text This episode was recorded live at SEMICON Europa. Michael Zahn from Koh Young talks to Françoise von Trapp about the growing significance of metrology in semiconductor manufacturing and the need for advanced measurement technologies. They discuss the transition from 2D to 3D measurements in semiconductor manufacturing. Zahn explains …

1
SEMICON Europa 3D InCites Member Spotlight: 20 Under 30 Recipients and More 47:37

6M ago47:37

47:37

Send us a text This episode was recorded live at SEMICON Europa. It features interviews with four of the 20 under 30 Recognition Award recipients from Cadence, ERS Electronic, KLA, and Semilab. It also features updates from Comet Yxlon, Trymax Semiconductor, and DSV-IMS. SEMI Europe's 20 Under 30 program recognizes future leaders in the microelectr…

1
SEMICON Europa 2024: Can Digital Twins Help Solve Europe's Talent Gap and Build Technical Sovereignty? 46:13

6M ago46:13

46:13

Send us a text In this episode, recorded live at SEMICON Europa in Munich, Françoise von Trapp continues her conversations with the keynote speakers on helping to build Europe’s technical sovereignty, and how implementing digital twins can help achieve this goal. John Behnke, of Inficon, discussed the evolution of smart manufacturing in the semicon…

1
SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth? 43:57

6M ago43:57

43:57

Send us a text This episode was recorded live at SEMICON Europa in Munich. This year's theme of this year’s conference is "Innovation and Collaboration: Powering Sustainable Exponential Growth". In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero go…

1
The U.S. CHIPS for America Mash-Up 44:19

7M ago44:19

44:19

Send us a text It's been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline of the year's progress…

1
Onto Innovation's PACE Partners Talk About Collaborating on Panel-Level Packaging 1:06:25

7M ago1:06:25

1:06:25

Send us a text On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence - or as it's being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of PLP …

1
Witnessing Foundry 2.0 In Action with NHanced Semiconductor's Bob Patti and Carl Petteway 53:29

7M ago53:29

53:29

Send us a text For this 3D InCites Podcast Extra, Françoise von Trapp traveled to Morrisville, North Carolina, to witness Foundry 2.0 in action at NHanced Semiconductors. She speaks with founder and CEO Bob Patti about his vision for the company, which is based on implementing the Foundry 2.0 business model he conceptualized. It involves sourcing d…

1
LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024 1:25:34

7M ago1:25:34

1:25:34

Send us a text Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technology, Inc., explains the difference between laminate and strip-based substrates f…

1
IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers 20:30

7M ago20:30

20:30

Send us a text At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. In this episode, Françoise…

1
Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging 49:14

8M ago49:14

49:14

Send us a text This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act's funding distribution and its impact …

1
Lam Research’s Chee Ping Lee Explains the Role of HBM in Generative AI 40:38

8M ago40:38

40:38

Send us a text In this episode, Françoise von Trapp speaks with Chee Ping Lee, of Lam Research, about the critical role of high bandwidth memory (HBM) in generative AI, emphasizing its high bandwidth and compact design. HBM memory has received a lot of attention as one of the first technologies to implement 2.5D and 3D stacking. Lee explains how HB…

1
Comet's Isabella Drolz Explains How 3D X-Ray Uses AI to Help Build AI Chips 20:52

8M ago20:52

20:52

Send us a text In this episode, Francoise von Trapp speaks with Isabella Drolz from Comet about how AI is revolutionizing semiconductor inspection strategies, particularly in 3D X-ray systems. They discuss how AI is being used to find structural defects in advanced chip packages, and also how 3D inspection is being used to develop advanced AI techn…

1
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX 35:31

8M ago35:31

35:31

Send us a text In this episode, Francoise speaks with Simon McElrea, an interconnectologist, about his career in and the evolution of interconnectology, emphasizing its importance in semiconductor packaging. McElrea discusses his roles at semiconductor start-ups like Vertical Circuits and Invensas; his foray into wireless charging at Energous and F…

1
Monita Pau and Jiangtao Hu Talk About Addressing The Challenges of Metrology for Advanced Packaging 29:58

9M ago29:58

29:58

Send us a text In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency of very fine fe…

1
Tarak Railkar and Benson Chan Preview IMAPS Symposium 2024 23:40

9M ago23:40

23:40

Send us a text In this episode, Tarak Railkar and Benson Chan join Françoise von Trapp for a preview of The IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-trac…

1
Bruce Kim of SurplusGLOBAL: The Impact of the CHIPS Act on the Secondary Equipment Market 25:19

9M ago25:19

25:19

Send us a text In this episode, Françoise von Trapp speaks with Bruce Kim, of SurplusGLOBAL, for an update on the semiconductor secondary equipment market, and how the US. and European Chips Acts are impacting it. They also discuss the trend of top-tier OEMS prioritizing the development of innovative technology rather than investing in legacy tools…

1
30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development 26:56

9M ago26:56

26:56

Send us a text In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of u…

1
SEMICON West 2024: Updates on The SEMI Climate Consortium and Workforce Development 33:18

10M ago33:18

33:18

Send us a text This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics. …

1
Navigating The Touchpoints of the Semiconductor Equipment Journey 44:28

10M ago44:28

44:28

Send us a text The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows. The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit a fab with its highly…

1
3D InCites Members Share Perspectives from SEMICON West 2024 1:46:29

10M ago1:46:29

1:46:29

Send us a text This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using inter…

1
Undersecretary Jose Fernandez on Securing Critical Supply Chains in the 21st Century 19:41

10M ago19:41

19:41

Send us a text Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology. This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Depa…

1
Dr. Laurie Locascio, Undersecretary of Commerce, Talks about U.S. Investment in Semiconductor Manufacturing 18:03

11M ago18:03

18:03

Send us a text Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies. Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and Science Act, …

1
Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs 27:38

11M ago27:38

27:38

Send us a text Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing importance of digital twi…

1
How Do You Break Through the Silicon Ceiling? A Conversation with Christine King 34:10

11M ago34:10

34:10

Send us a text In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and p…

1
The Saxony Story: How to Develop a Global Semiconductor Cluster 37:32

11M ago37:32

37:32

Send us a text Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and Ja…

1
Highlights and Aha! Moments of ECTC 2024: A Recap with Karlheinz Bock and Michael Mayer 25:40

11M ago25:40

25:40

Send us a text Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the format an…

1
Community Members Share Insights from ECTC 2024 1:53:43

12M ago1:53:43

1:53:43

Send us a text This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology advancement…

1
ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging? 34:17

12M ago34:17

34:17

Send us a text Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficie…

1
SEMI America’s Joe Stockunas Talks About SEMICON West Past, Present and Future 26:46

12M ago26:46

26:46

Send us a text In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West's Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe …

1
LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging 29:58

1y ago29:58

29:58

Send us a text Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass. In this epis…

1
Conversations with the Winners of the 2024 3D InCites Awards 45:47

1y ago45:47

45:47

Send us a text This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates i…

1
Member Spotlight: IMAPS Devices Packaging Conference Celebrates 20 Years 55:55

1y ago55:55

55:55

Send us a text This episode was recorded live at the IMAPS Device Packaging Conference – helping celebrate the event’s 20th year. The record turnout included many of our 3D InCites Community members. Françoise von Trapp spoke with several of them who were exhibiting and presenting, and in some cases, simply attending. Alex Ospina of ACM Research di…

1
IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem 39:41

1y ago39:41

39:41

Send us a text This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia. Dan…

1
The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 35:01

1y ago35:01

35:01

Send us a text This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company…

1
SEMI ISS Europe Panel: Empowering Semiconductor Excellence in Europe 56:33

1y ago56:33

56:33

Send us a text In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal. Panelists include: Manfred Horstmann, …

1
SEMI ISS Europe: Creating Resilient Semiconductor Supply Chains and The Impact of Geopolitics on Energy 51:11

1y ago51:11

51:11

Send us a text This week’s episode was recorded at ISS Europe, in Vienna, where the European semiconductor industries key strategists gathered to plan the path forward and forge a sustainable path to securing 20% of the global semiconductor market. One of the main topics continues to be building a resilient semiconductor supply chain. In the first …

1
International Women’s Day Special: Creating a Culture of Diversity, Equity, Inclusion and Belonging 34:49

1y ago34:49

34:49

Send us a text In honor of International Women’s Day (IWD 2024), 3D InCites partnered with SEMI ISS to bring you this episode on how companies are fostering and implementing DEIB and allyship into their corporate culture. Françoise von Trapp speaks with Nigel Wenden, CEO of WGNSTAR, Laura Matz, CTO of Merck KGAA Darmstadt Germany; and Mike Rosa, CM…

1
Scott Hayes and Amy Lujan Talk About The History of IMAPS DPC and The Line-up for 2024 27:32

1+ y ago27:32

27:32

Send us a text The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ. In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC a…

Podcasts Worth a Listen

Francoise Von Trapp Podcasts

Podcasts Worth a Listen