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The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024

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Manage episode 409236741 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Send us a text

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging.

Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law.

You’ll learn about:

  • Chiplets architectures for high-performance applications
  • How chiplets can enable foundational AI models that can be applied to various business use cases
  • Challenges in chiplet design and test
  • The importance of open interface standards

Contact our guests on LinkedIn:

Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry.

Real Talk About Marketing
An Acxiom podcast where we discuss marketing made better, bringing you real...

Listen on: Apple Podcasts Spotify

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 (00:00:00)

2. [Ad] Real Talk About Marketing (00:21:19)

3. (Cont.) The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 (00:22:09)

167 episodes

Artwork
iconShare
 
Manage episode 409236741 series 2935206
Content provided by Francoise von Trapp. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by Francoise von Trapp or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Send us a text

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging.

Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law.

You’ll learn about:

  • Chiplets architectures for high-performance applications
  • How chiplets can enable foundational AI models that can be applied to various business use cases
  • Challenges in chiplet design and test
  • The importance of open interface standards

Contact our guests on LinkedIn:

Next week, our coverage of IMAPS continues, as we bring you conversations from the Global Business Council, which focused on repatriating the US microelectronics industry. You’ll get perspectives from academia, the government, and industry.

Real Talk About Marketing
An Acxiom podcast where we discuss marketing made better, bringing you real...

Listen on: Apple Podcasts Spotify

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show

Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

  continue reading

Chapters

1. The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 (00:00:00)

2. [Ad] Real Talk About Marketing (00:21:19)

3. (Cont.) The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations from IMAPS DPC 2024 (00:22:09)

167 episodes

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