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Packaging innovation for space applications - with Texas Instruments

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Manage episode 413207253 series 2883175
Content provided by satsearch. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by satsearch or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.

In the episode we cover:

  • The benefits of using plastic packages vs. ceramic packaging
  • These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
  • The role that Texas Instruments has played in supporting the standardization of QMLP
  • How and why TI will continue to offer QMLV-RHA (ceramic) packaging
  • How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities

You can find out more about Texas Instruments here on their satsearch supplier hub.

And if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter.

[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/when-we-get-there License code: Y4KZEAESHXDHNYRA]

  continue reading

79 episodes

Artwork
iconShare
 
Manage episode 413207253 series 2883175
Content provided by satsearch. All podcast content including episodes, graphics, and podcast descriptions are uploaded and provided directly by satsearch or their podcast platform partner. If you believe someone is using your copyrighted work without your permission, you can follow the process outlined here https://podcastplayer.com/legal.

Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.

In the episode we cover:

  • The benefits of using plastic packages vs. ceramic packaging
  • These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
  • The role that Texas Instruments has played in supporting the standardization of QMLP
  • How and why TI will continue to offer QMLV-RHA (ceramic) packaging
  • How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities

You can find out more about Texas Instruments here on their satsearch supplier hub.

And if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter.

[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/when-we-get-there License code: Y4KZEAESHXDHNYRA]

  continue reading

79 episodes

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